Suitable for wafers of 12 inches and below; Mounting accuracy: ± 1 μ m @ 3 σ; Angle accuracy: ± 0.01 ° @ 3 σ (33mm>die>=10mm), ±0.05°@3σ(10mm>die>2mm)； Specialized in handling multi-layer Die, heterogeneous integration of 2D, 2.5D, and 3D; The real-time active tip tilt control system can accurately adjust the coplanarity of the pulse heater; Accurate force control, capable of providing a maximum surface mount pressure of 300N and a pressure control accuracy of 0.05N; Inert environment enables unique LPC process technology.
