Solder Paste

Lead solder paste

Category	Product	Alloy composition	Grain	Melting point (° C)	Scope of application
No wash lead solder paste/ Wash with lead solder paste		Sn63Pb37	20-38μm	183	Applicable to SMT patch products without environmental requirements LED、 Welding of products in high-precision instruments, electronics industry, communication, aviation industry, maintenance field, etc
			25-48μm
			10-20μm
		Sn60Pb40	20-38μm	183-190
			25-48μm
		Sn55Pb45	25-48μm	183-203
		Sn62.8Pb36.8Ag0.4	20-38μm	180-183	Suitable for welding products such as QFN, QFP, IC chips, nickel plating, zinc plating, automotive electronic components, communication, aviation industry, and maintenance fields
			25-48μm
		Sn62.8Pb37Ag0.2	20-38μm	180-183
			25-48μm
		Sn10Pb88Ag2	20-38μm	278	ROHS exempt products High lead and high silver are suitable for welding high-precision instruments, semiconductors, microtechnology, high-speed rail technology, aviation industry and other products.
		Sn5Pb92.5Ag2.5	20-38μm	287
		Sn10Pb90	20-38μm	275-302
		Sn62Pb36Ag2	20-38μm	175-182

Lead-free solder paste

Category	Product	Alloy composition	Grain	Melting point (° C)	Scope of application
免洗无铅锡膏/ 水洗无铅锡膏		Sn96.5Ag3.0Cu0.5	20-38μm/25-48μm	217	Suitable for soldering products such as QFN, QFP, IC chips, nickel plating, zinc plating, automotive electronic components, communication 5G, aviation industry, and micro technology fields
			15-25μm/10-20μm
			5-15μm/1-10μm
		Sn98.5Ag1.0Cu0.5	20-38μm	220	Widely used in SMT flat printing and surface mount technology. It is also suitable for joining gaps between high-power electronic products.
		Sn99Ag0.3Cu0.7	20-38μm/25-48μm	227
		Sn96.5Ag3.5	20-38μm/25-48μm	204-220	Soft solder paste is used for welding metal such as structural components, nickel plating, tin plating, etc
		Sn64.7Ag0.3Bi35	25-48μm	172	Medium temperature lead-free soldering, suitable for: LED、USB、 Temperature controllers and other SMT surface mount and repair products, with a temperature resistance not exceeding 230 ℃
		Sn64Ag1.0Bi35	25-48μm	172
		Sn64.5Bi35Cu0.5	25-48μm	138-187	Medium temperature copper with low temperature resistance and high strength, suitable for solder joints with temperature resistance not exceeding 220 degrees and high tensile strength
		Sn42Bi57Ag1	25-48μm	138	Low temperature lead-free soldering, suitable for: metal surface soldering
		Sn42Bi57.6Ag0.4	25-48μm	138
		Sn42Bi58	25-48μm	138	Low temperature lead-free soldering, suitable for LED surface mount processing and maintenance field